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Doya UV Laser Cutting System For FPC/PCB

Doya UV Laser Cutting System For FPC/PCB

The DOYA DUCD-12 UV Laser Cutting System is a high-precision machine engineered for the delicate and accurate cutting of micro-electronic materials such as FPC and PCB. It employs a cold-processing technique using either a 355 nm UV laser or a 532 nm green laser, supported by a high-performance CCD vision system for automatic positioning and cutting accuracy of ยฑ20 ฮผm. The system features a stable marble platform and a high-precision linear motor for smooth and accurate XYZ-axis motion. Additionally, it can be integrated into SMT production lines via a conveyor belt, enabling fully automated mass-production workflows.
12W
30W
Category: Laser welding and Cutting
Brand: DOYA

UV Laser Cutting System For FPC/PCB ๐Ÿ’ก

The DUCD-12 UV Laser Cutting System is a high-precision solution designed to meet the demanding processing requirements of the modern electronics industry. Using advanced UV (355 nm) or Green Laser (532 nm) cold-processing technology, it delivers exceptional cutting quality with minimal thermal impactโ€”making it ideal for sensitive materials like FPC and PCB.

High Precision & Automatic Control

The DUCD-12 is engineered for extreme accuracy. Its integrated CCD vision system and professional software enable automatic positioning for consistent, repeatable results. Equipped with XYZ-axis motion driven by a high-precision linear motor on a stable marble platform, the system ensures low vibration, minimal thermal interference, and highly stable cutting performance.

Cold Processing Advantage

The UV and Green laser sources use a โ€œcold processingโ€ method in which high-energy photons directly break molecular bonds. This significantly reduces heat-affected zones, preventing burning, deformation, or damage to delicate materials. The result is cleaner cut edges, higher yield, and superior overall quality for micro-electronic applications.

Automation & SMT Line Integration

For high-volume production, the DUCD-12 can be configured with a conveyor belt system for direct integration into SMT (Surface Mount Technology) lines. This enables seamless automated operation, improving workflow efficiency and boosting throughput in mass-production environments.

Primary Applications

  • Cutting and segmentation of FPC (Flexible PCB) and PCB (Printed Circuit Board)
  • Precision dicing and scribing of thin materials such as ITO film
  • Processing of delicate or rigid materials including glass and ceramics

Technical Specification

 

Parameter

Value

ModelDUCD-12
Laser PowerUV 12 W / Green Laser 30 W
Working Area400 ร— 400 mm
Wavelength355 nm (UV) or 532 nm (Green)
Accuracyยฑ20 ฮผm
Diameter of Light Beam< ยฑ20 ฮผm
Motion SystemXYZ Axis with High-Precision Linear Motor
PlatformMarble Platform
PositioningHigh-performance CCD Vision System (Automatic Positioning)
Dimensions (L ร— W ร— H)1300 ร— 1100 ร— 1750 mm
Weight900 KG
Automation OptionConveyor belt for SMT pipeline connection