Fiber Laser Marking Machine
The MRJ-Laser Fiber Laser Marking Machine series utilizes an...
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+971 50 636 2463The UV Laser Marking Machine stands out for its short wavelength (355 nm), which enables the laser to break molecular bonds within the material instead of melting or vaporizing it. This process, known as βcold processing,β minimizes thermal impact β preventing deformation, cracking, or micro-fissures, particularly in delicate or heat-sensitive materials.
1. Cold Marking Technology
Employs a non-thermal marking process that eliminates heat effects, resulting in ultra-fine, smooth, and burr-free marks. Ideal for substrates that are easily damaged by heat.
2. High Beam Quality
Generates an exceptionally small focused spot, enabling high-definition engraving, intricate patterns, and microscopic text or logos.
3. Specialized Glass Marking
Highly effective for marking and engraving various types of glass, including bottles, crystals, and decorative glassware, as well as ceramics and silicon wafers.
4. Versatile Material Compatibility
The UV laser is widely used across industries for its ability to produce clean, high-contrast marks on a range of materials:
Specification | Detail (Typical Range) |
|---|---|
| Laser Source | Diode-Pumped Solid-State (DPSS) UV Laser |
| Wavelength | 355 nm |
| Laser Power | 3 W / 5 W / 10 W (Standard) |
| Maximum Marking Speed | β₯ 7000 mm/s (Dependent on galvanometer performance) |
| Minimum Line Width | β€ 0.01 mm |
| Minimum Character Size | 0.1 mm |
| Repeat Precision | Β± 0.002 mm |
| Cooling Method | Water Cooling or Air Cooling |
| Applicable Materials | Glass, Crystal, Ceramics, Silicon Wafer, FPC, PCB, Film, Polymers, most Plastics, and select Coated Metals |
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